Panduit GB2B0306TPI-1 | Structured Ground Telecom Grd Busbars, 0306, Copper, Tin-Plated
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Panduit GB2B0306TPI-1 | Structured Ground Telecom Grd Busbars, 0306...
Description
Description
Ensure network performance and safety with our telecommunications grounding busbar with corrosion-resistant copper, and ready-to-use brackets and insulators for quick setup.
The GB2B0306TPI-1 Grounding Busbar meets BICSI and J-STD-607-A requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
Panduit StructuredGround Grounding Busbar, Telecommunication, 2 in Bar Width, 12 in Bar Length, 1/4 in Bar Height, 600 VAC, 9 Mounting Hole Quantity, Flat Construction, Copper, Tin Plated
Panduit - GB2B0306TPI-1 - Features
- Available with different hole pattern spacing including NEMA, BICSI and 1 in
- Made of high conductivity copper and tin plated to inhibit corrosion
- Pre-assembled with brackets and insulators attached for quick installation
- Meets BICSI and J-STD-607-A requirements for network systems grounding applications
- Made of high conductivity copper and tin-plated to inhibit corrosion
- Comes pre-assembled with brackets and insulators attached for quick installation
- Use Panduit self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below
Specifications
Specifications
Panduit - GB2B0306TPI-1 - Specifications
| Brand Name | Panduit |
|---|---|
| Manufacturer Part Number | GB2B0306TPI-1 |
| Component | Busbars |
| Ground Rod Material | Copperbonded |
| UNSPSC Code | 39121400 |
| Sub Brand | StructuredGround |
| Material | Copper |
| Overall Length (In.) | 12 |
| Overall Length (mm) | 304.8 |
| Overall Width (In.) | 2 |
| Overall Width (mm) | 50.8 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.44 |
| Stud Hole Size (mm) | 11.17 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
| UPC | 07498365927 |
Panduit - GB2B0306TPI-1 - Environmental Information
| RoHS Status | ROHS3 Compliant |
|---|---|
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | EAR99 |
| HTSUS | 8536.90.8585 |
Documents and Downloads
Documents and Downloads
- Panduit GB2B0306TPI-1 Specification Sheet
- Panduit GB2B0306TPI-1 Catalog Cut Sheets
- Panduit GB2B0306TPI-1 Part Drawings
- Panduit GB2B0306TPI-1 Articles
- Panduit GB2B0306TPI-1 Articles
- Panduit GB2B0306TPI-1 Articles
- Panduit GB2B0306TPI-1 Articles
- Panduit GB2B0306TPI-1 Flyers
- Panduit GB2B0306TPI-1 RoHS Statement
Payment & Security
Payment methods
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