Panduit GB4B0624TPI-1 | Structured Ground Telecom Grd Busbars, 0624, Copper, Tin-Plated
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Panduit GB4B0624TPI-1 | Structured Ground Telecom Grd Busbars, 0624...
Description
Description
Ground your network equipment with our pre-assembled telecommunications main grounding busbar, featuring durable copper, and ready-to-use components for fast installation.
The GB4B0624TPI-1 Grounding Busbar meets BICSI and J-STD-607-A requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, GB4B0624TPI-1 comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels can be used to identify busbars.
Panduit StructuredGround Grounding Busbar, Telecommunication, 4 in Bar Width, 20 in Bar Length, 1/4 in Bar Height, 600 VAC, 30 Mounting Hole Quantity, Flat Construction, Copper, Tin Plated
Panduit - GB4B0624TPI-1 - Features
- Available with different hole pattern spacing including NEMA, BICSI and 1 in
- Made of high conductivity copper and tin plated to inhibit corrosion
- Pre-assembled with brackets and insulators attached for quick installation
- Meets BICSI and J-STD-607-A requirements for network systems grounding applications
- Made of high conductivity copper and tin-plated to inhibit corrosion
- Comes pre-assembled with brackets and insulators attached for quick installation
- Use Panduit self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below
Specifications
Specifications
Panduit - GB4B0624TPI-1 - Specifications
| Brand Name | Panduit |
|---|---|
| Manufacturer Part Number | GB4B0624TPI-1 |
| Component | Busbars |
| Connection Type | Mechanical |
| Material Rating | Copper |
| UNSPSC Code | 39121400 |
| Sub Brand | StructuredGround |
| Material | Copper |
| Overall Length (In.) | 20 |
| Overall Length (mm) | 508 |
| Overall Width (In.) | 4 |
| Overall Width (mm) | 101.6 |
| Overall Height (In.) | 3.25 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.44 |
| Stud Hole Size (mm) | 11.2 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Resistance Properties | Corrosion-Resistant |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
| UPC | 07498334541 |
Panduit - GB4B0624TPI-1 - Environmental Information
| RoHS Status | ROHS3 Compliant |
|---|---|
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | EAR99 |
| HTSUS | 8536.90.8585 |
Payment & Security
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